If you are in search of dependable AM91L02DM-B Microcircuit Memory products, you can count on Rapid Mil Parts. You have taken a particular interest in part number AM91L02DM-B, a Advanced Micro Devices Inc component that is listed with the NSN 5962010436195 for identification purposes. When you are prepared to start the purchasing process for part number AM91L02DM-B, we provide online RFQ forms to fill out and submit for the means of receiving competitive quotes for your comparisons.
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Our dedication to quality is not merely a statement, and we strive to always exceed industry expectations for your benefit with the best NSN products, aerospace parts, military and defense parts, and other similar items on the market. For your convenience, part number AM91L02DM-B is listed alongside the NSN 5962-01-043-6195 and is categorized under the FSC 5962 Microcircuits Electronic.
Additionally, this NSN part is specifically produced under CAGE Code 34335, which identifies the specific Advanced Micro Devices Inc facility it traces back to. If you are interested in kicking off procurement for your needs through phone or email or simply wish to discuss our diverse services and your purchasing options, do not hesitate to connect with a staff member of ours today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-043-6195 Item Description: MICROCIRCUIT,MEMORY | 5962 | 010436195 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| AM91L02DM-B | 3 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | Memory Device Type | RAM |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 13 INPUT |
| ADAT | Body Width | 0.278 INCHES MINIMUM AND 0.298 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC AND GLASS |
| TTQY | Terminal Type And Quantity | 16 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND LOW POWER AND W/STORAGE AND W/DECODED OUTPUT |
| ADAQ | Body Length | 0.770 INCHES MINIMUM AND 0.808 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 260.0 MILLIWATTS |
| ADAU | Body Height | 0.085 INCHES MINIMUM AND 0.124 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| MRC | Decoded Requirement | Clear Text Reply |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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