If you are in search of dependable CY7C235-40DMB Microcircuit Memory products, you can count on Rapid Mil Parts. You have taken a particular interest in part number CY7C235-40DMB, a Cypress Semiconductor Inc component that is listed with the NSN 5962013367012 for identification purposes. When you are prepared to start the purchasing process for part number CY7C235-40DMB, we provide online RFQ forms to fill out and submit for the means of receiving competitive quotes for your comparisons.
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Our dedication to quality is not merely a statement, and we strive to always exceed industry expectations for your benefit with the best NSN products, aerospace parts, military and defense parts, and other similar items on the market. For your convenience, part number CY7C235-40DMB is listed alongside the NSN 5962-01-336-7012 and is categorized under the FSC 5962 Microcircuits Electronic.
Additionally, this NSN part is specifically produced under CAGE Code 65786, which identifies the specific Cypress Semiconductor Inc facility it traces back to. If you are interested in kicking off procurement for your needs through phone or email or simply wish to discuss our diverse services and your purchasing options, do not hesitate to connect with a staff member of ours today!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-336-7012 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013367012 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-8863601LX | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES NOMINAL TOTAL SUPPLY |
| CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
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